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BST555 Copper protection
Description

Is a water-soluble copper protective agent, It forms a colorless transparent protective film on the chemical copper plating of copper or other copper and copper alloy surfaces. This protective film layer  not affect the solderability the properties of copper, almost  not change the contact resistance; the process is simple, only need to thoroughly clean the workpiece immersed in working fluid, and then washing drying on the line;
Safety and environmental protection; equipment corrosion is small;

SPEC

Appearance:colorless clear liquid
Odor: slightly sour
Density: 1.0 ± 0.05 @ 25 ℃
Solubility: with less organic solvents, and water were dissolved
Packing: 25L /barrel

Range Of Application

Unless otherwise specified PCB and electronics industries

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